Scientific Comitee
The Scientific Committee is composed of internationally recognized experts who play a key role in shaping the scientific direction and ensuring the academic excellence of the Academy.
Laser cutting,drilling and machining (SC-CDM)
Challenges in laser cutting, drilling and machining
(1) Composite materials cutting including minimising recast and heat affected zones, processing speed (materials removal rate) and throughput;
(2) Defect-free brittle materials cutting;
(3) Non-uniform thickness materials and thick session materials cutting;
(4) Striation-free laser cutting;
(5) Laser cold cutting and drilling of engineering materials (heat affected zone less than 1 micron) at high material removal rate;
(6) Zero-taper hope drilling, reversed taper hole drilling;
(7) Effective shaped hole drilling with a single laser;
(8) High-aspect ratio (>20:1) hole drilling;
(9) Crack-free drilling of brittle materials.
Laser welding and joining (SC-WJ)
Challenges in laser welding
(1) Porosity issue in welding lightweight materials and thick section materials;
(2) Laser welding of thick session materials > 25 mm with high quality;
(3) Laser welding of dissimilar materials (especially between metal and non-metal);
(4) Laser welding of nano-materials;
(5) Laser welding of high reflection materials with high quality and high energy efficiency;
(6) Laser welding of glass and ceramics.
Laser additive manufacturing (SC-AM) International Collaboration
Challenges in laser additive manufacturing
Definition: 2D additive patterning and 3D components by laser layered additive manufacturing.
(1) Photonic Integrated Circuit (PIC) fabrication by lasers;
(2) Functional nano-structures (such as graphene, metamaterials) by laser additive manufacturing;
(3) Laser additive manufacturing with blown powders: resolution, accuracy, distortion and surface finishing;
(4) Multiple materials and multi-functional materials additive manufacturing;
(5) Laser direct writing deposition: efficiency and throughput;
(6) Deposition of electronics materials.
Laser micro/nano Fabrication (SC-MNF)
Challenges in laser micro/nano fabrications
1. Surface texturing: (metals, semiconductors, ceramic and plastic) Metal Wettability change with time: mechanisms (mixed effect of micro/nanostructures, Carbon/oxide and charging effects);
2. Super-resolution and far field nano-imaging: Active 3D meta-materials;
3. Laser tuning of chemical reactions;
4. Other 2D materials: Hybrid 2D materials and PLD etc.;
5. Laser cold processing;
6. Large scale micro/nanostructures fabrication;
7. Super-capacitor;
8. Cold Graphene deposition;
9. Fast charging battery;
10. Multi-wavelength interference with white light laser nano-lithography;
11. Laser nano-welding of metallic NPs;
Laser surface engineering (SC-SE)
Challenges in laser surface engineering
Laser surface engineering includes but not limited to cladding, alloying, hardening, cleaning, polishing, Shock peening, macro-texturing/abrading,
(1) Laser cladding low cost and high surface finishes (benchmarking with electroless plating);
(2) Laser cladding of ceramic without cracks;
(3) Cladding metals on plastics;
(4) Cold cladding;
(5) Laser surface engineering with low surface smoothness;
(6) Laser polishing with surface roughness Ra <10 nm;
(7) Laser assisted localised polishing of optics with surface smoothness <1 nm.
(8) Laser surface engineering inside the small diameter tubes;
Lasers, systems and components (SC- LSC)
Challenges in lasers, optical components and systems
(1) Ultrafast laser (ps, fs and as) for industrial scale applications;
(2) High power laser wavelength tunability;
(3) High peak power laser beam transmission through an optical fibers;
(4) Laser beam handling (e.g. high speed scanning; fs laser pulse dispersion problems);
Modelling and simulation (SC-MS)
Challenges in modelling and simulations
1. Lack of detailed data of materials’ optical and thermal property databases above 1000 degrees;
2. Multi-phase, multi-materials, multi-scales;
3. Documents on the research outcomes in modelling and simulation over the last 40 years, to reduce the duplicating the research works, Historical data reinventing wheels;
4. Modelling validation, not by the same group;
5. How many photons needed for the processing? How much it cost for a photon?
6. Additive/ablation: precisely predict materials addition and loss in modelling;
7. From laser parameters to components properties: macroscopic/microscopic impacts/efficiency of photons;
Photonic science and imaging (SC-PI)
Challenges in photonic sciences
(1) Large-area periodic designed sub-wavelength structures fabrication at a high speed;
(2) Far-field super-resolution imaging and fabrication;
(3) Loss problem in metamaterials;
(4) Laser interaction with nano-material and properties;
(5) Nanophotonics devices: bandwidth >100 THz; power consumption <1 fJ/bit; light source, detector, waveguide, modulator and switch.
Laser hybrid processes (SC-HP)
This Scientific Committee focuses on hybrid laser and non-laser manufacturing processes and related scientific and technological issues.
Examples of such processes may include:
- hybrid laser/arc welding,
- hybrid laser/water cutting,
- hybrid laser/ECM machining,
- hybrid or sequential laser/EDM drilling,
- electrical current or magnetic assisted laser welding etc.
The understanding of energy field interactions in these processes and the identification of added values compared with laser alone or non-laser processes are the main scientific challenges.
Emerging technologies (SC-ET)
Grand challenges in laser materials processing
1. Low-cost high-throughput high-quality cold laser machining.
2. Energy efficiency in laser processing.
3. Standardization of laser sources, systems and processing.
4. Micro/nano-processing for large area/macro-parts; high efficiency to high resolution.