Challenges in laser cutting, drilling and machining

  1. Composite materials cutting including minimising recast and heat affected zones, processing speed (materials removal rate) and throughput;
  2. Defect-free brittle materials cutting;
  3. Non-uniform thickness materials and thick section materials cutting;
  4. Striation-free laser cutting;
  5. Laser cold cutting and drilling of engineering materials (heat affected zone less than 1 micron) at high material removal rate;
  6. Zero-taper hole drilling, reversed taper hole drilling;
  7. Effective shaped hole drilling with a single laser;
  8. High-aspect ratio (> 20:1) hole drilling;
  9. Crack-free drilling of brittle materials.