- Composite materials cutting including minimising recast and heat affected zones, processing speed (materials removal rate) and throughput;
- Defect-free brittle materials cutting;
- Non-uniform thickness materials and thick section materials cutting;
- Striation-free laser cutting;
- Laser cold cutting and drilling of engineering materials (heat affected zone less than 1 micron) at high material removal rate;
- Zero-taper hole drilling, reversed taper hole drilling;
- Effective shaped hole drilling with a single laser;
- High-aspect ratio (> 20:1) hole drilling;
- Crack-free drilling of brittle materials.